型号:

6-520315-3

RoHS:无铅 / 符合
制造商:TE Connectivity描述:CONN TRIO MATE FLX FLM 13POS TIN
详细参数
数值
产品分类 连接器,互连式 >> FFC,FPC(扁平软线)- 连接器 - 面板安装
6-520315-3 PDF
RoHS指令信息 6-520315-3 Statement of Compliance
3D 型号 6-520315-3.pdf
标准包装 2,520
系列 Triomate
连接器类型 垂直触点,单面
位置数 13
间距 0.100"(2.54mm)
FFC,FCB 厚度 0.13mm ~ 0.38mm
板上方高度 0.273"(6.93mm)
安装类型 通孔
线缆端类型 直形
端子 纽结引脚
锁定功能 -
特点 -
包装 散装
触点表面涂层
触点涂层厚度 -
工作温度 -55°C ~ 105°C
额定电流 1.00A
额定电压 250V
体座材料 热塑塑胶,玻璃纤维增强型
相关参数
IDT70V5378S166BC IDT, Integrated Device Technology Inc IC SRAM 576KBIT 166MHZ 256BGA
MPC8544AVTAQG Freescale Semiconductor IC MPU POWERQUICC III 783-FCBGA
IDT70T653MS15BC8 IDT, Integrated Device Technology Inc IC SRAM 18MBIT 15NS 256BGA
MPC8544AVTANG Freescale Semiconductor IC MPU POWERQUICC III 783-FCBGA
1-1734798-2 TE Connectivity CONN HOUSING FPC 12POS R/A SMD
IDT70T3539MS133BC8 IDT, Integrated Device Technology Inc IC SRAM 18MBIT 133MHZ 256BGA
1-2013928-4 TE Connectivity CONN FPC 37POS .3MM FLIP LOC SMD
IDT70V5388S133BC8 IDT, Integrated Device Technology Inc IC SRAM 1.125MBIT 133MHZ 256BGA
MPC8544AVTALF Freescale Semiconductor IC MPU POWERQUICC III 783-FCBGA
1-2013928-4 TE Connectivity CONN FPC 37POS .3MM FLIP LOC SMD
IDT70V5388S100BC IDT, Integrated Device Technology Inc IC SRAM 1.125MBIT 100MHZ 256-BGA
MPC8548ECVUAQG Freescale Semiconductor IC MPU POWERQUICC III 783-FCCBGA
1-2013928-4 TE Connectivity CONN FPC 37POS .3MM FLIP LOC SMD
CY7C1513KV18-333BZI Cypress Semiconductor Corp IC SRAM 72MBIT 333MHZ 165-FPBGA
5-487509-7 TE Connectivity CONN TRIO-MATE 8POS .100 PCB
5-520315-5 TE Connectivity CONN TRI-MATE .100 5POS VERT
CY7C0853V-100BBC Cypress Semiconductor Corp IC SRAM 9MBIT 100MHZ 172LFBGA
IDT70V5378S166BG8 IDT, Integrated Device Technology Inc IC SRAM 576KBIT 166MHZ 272BGA
3-1734248-0 TE Connectivity CONN FPC/ZIF 30POS 1MM VERT SMD
CY7C1568KV18-400BZXCT Cypress Semiconductor Corp IC SRAM 72MBIT 400MHZ 165LFBGA